Description
The Applied Materials (AMAT) part number 0041-50966 (often cross-referenced with ecosystem identifiers like 0010-53178 or system descriptions like ESC Centura Centris DPS2) is an Electrostatic Chuck (ESC) Bonding Assembly. It is utilized inside AMAT’s advanced semiconductor wafer processing platforms—specifically associated with etch and deposition systems such as the Centura / Centris (e.g., DPS – Decoupled Plasma Source chambers).
Key Specifications & Identification
| Attribute | Details |
| Manufacturer | Applied Materials (AMAT) |
| Part / Catalog Number | 0041-50966 |
| Module Description | Assembly, ESC Bonding, Full Symmetry, Multi-Zone (e.g., 4-Zone V2) |
| Equipment Family | Centura / Centris / SYM3 Etch & Deposition systems |
| Core Function | Clamping and thermal regulation of semiconductor wafers via electrostatic force during vacuum processing |
| Cooling / Zoning | Multi-zone thermal control architecture (optimized for precise radial temperature tuning across 300mm wafers) |
Primary System Functions
- Electrostatic Wafer Clamping: Applies high DC voltages to internal electrodes, creating an electrostatic charge that securely clamps silicon wafers flat against the chuck surface under high-vacuum conditions.
- Backside Gas Thermal Conduction: Manages backside cooling gas (typically Helium) distribution zones across multiple independent quadrants to maintain exact wafer temperatures during high-density plasma etching.
- Multi-Zone Temperature Control: Coordinates thermal zones to compensate for edge-effect variations during advanced dry-etch semiconductor processing steps.
Servicing & Handling Guidelines
- Electrostatic Discharge (ESC) & High Voltage Sensitivity: Internal ceramic dielectric layers and high-voltage DC pin connections require rigorous handling safeguards to prevent dielectric breakdown, arcing, or particle contamination.
- Cleanroom Protocol: Because this component is installed inside high-vacuum process chambers, it must be handled strictly inside cleanroom standards using particle-free ESD gloves and specialized tooling.
- O-Ring & Seal Replacement: Always replace all dynamic and static vacuum O-rings, fluid cooling seals, and electrical interface gaskets whenever unseating or reinstalling the ESC assembly into a process module.
